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This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent RepresentaTIon of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescripTIon Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item DescripTIon (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
