资 源 简 介
Allegro Package DesignerCadence Allegro Package Designer products streamline IC package design and IC package co-design. They comprise a complete constraint-driven physical designsolution that supports virtually all packaging methods. New chip-level I/Oplanning and co-design capabiliTIes based on Cadence First Encounterdeliver keycapabiliTIes to designers of complex, leading-edge devices. An embedded 3D fieldsolver provides full package-level simulaTIon modeling, enabling PCB designers todesign-in new devices faster and more accurately.
