资 源 简 介
大功率led的热模拟
计算流体动力学（CFD）建模的发光二极管（LED）组件已经变得越来越重要，因为它现在被应用到设计过程中。本文比较了Avago的高功率LED封装的结果（asmt-mx00）在金属芯印刷电路板（MCPCB）和双层FR4基板与散热器的实验数据。在比较讨论之后，指出了带有散热片的LED封装的热模拟技术。结果令人印象深刻，表明这种技术可用于LED系统级。
I. IntroducTIon
The predicTIon of the thermal performance of LEDs is becoming a necessity in reducing the TIme it takes to bring products to market. However， with increasing heat flux and package density， heat dissipaTIon of the LED package module is becoming a challenge; therefore， the thermal analysis and design of the module is becoming even more critical. CFD simulation is a widely used method for thermal analysis of electronic products in the early design stage. CFD is concerned with the numerical simulation of fluid flow， heat transfer， and other related processes such as radiation.
This paper presents work done to create a high power LED package on an MCPCB with heat sink and a double layer FR4 with heat sink. First， a detailed model of an LED package-on-substrate is created. Then a heat sink is created on the bottom of the LED package. Finally， this simulation data is compared to experimental data.
