资 源 简 介
PRODUCT M14C04n WAFER SIZE 152 mm (6 inches)n DIE IDENTIFICATION M14C04KA_Rn DIE SIZE (X x Y) 1465 x 1585 mmn SCRIBE LINE 101.6 x 101.6 mmn PAD OPENING 100 x 100 mmDIE LAYOUTn DI Die Identification (at the position shown in Figure 1)n C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)n C4, C6, C8 These ISO pins do not appear on the M14C04 dien NC This pad, shown in Figure 1, is Not ConnectedPad locations are measured relative to the die centre (where X and Y are respectively the horizontal andvertical axis, measured in mm).
