资 源 简 介
1. 适用范围RENESAS芯片支持情况.............................................................................12. 应用软件界面简介...................................................................................................43. 烧录器件的步骤.......................................................................................................53.1 选择器件...................................................................................................................53.2 将数据装入缓冲区...................................................................................................63.3 设置芯片配置信息及加密选项...............................................................................73.4 编程芯片...................................................................................................................83.5 量产........................................................................................................................... 83.6 组合操作...................................................................................................................94. 脱机模式.................................................................................................................104.1 脱机操作说明.........................................................................................................104.1.1 键盘使用规则.....................................................................................................104.1.2 菜单介绍.............................................................................................................104.1.3 创建脱机工程.....................................................................................................104.2 脱机操作步骤......................................................................................................... 115. 免责声明.................................................................................................................
