资 源 简 介
Thermal ConducTIvity： What is it and Why You Should Care
导热系数：材料传热能力的量度。给定两个表面的一个材料的两侧与它们之间的温度差，热导率是传热单位时间和单位面积，除以温度差1的热能转移。
导热系数是描述材料传热能力的体积特性。在图1中的公式中，导热系数是比例因子K。传热的距离被定义为通过材料传递的热速率（Q），从温度T1到温度T2，当T1 T2 T2 2。
Thermal conducTIvity of materials plays a significant role in the cooling of electronics equipment; from the die where the heat is generated to the cabinet where the electronics are housed， conducTIon heat transfer and， subsequently， thermal conducTIvity， are the integral components of the overall thermal management process.
The path of heat from the die to the outside environment is a complicated process that must be understood when designing a thermal solution. In the past， many devices were able to operate without requiring an external cooling device like a heatsink. In these devices， the conduction resistance from the die to the board needed to be optimized， as the primary heat transfer path was into the PCB. As power levels increased， heat transfer solely into the board became inadequate. Much of the heat is now dissipated directly into the environment through the top surface of the component. In these new higher-powered devices， low junction-to-case resistance is important， as is the design of the attached heatsink.
