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负空间应用设计：PC板电源设计的数字控制技术
越来越多的处理到网络和计算设备的印刷电路板（PCB）始终是一个“处理能力与权力”悖论。较新的集成电路（IC）的设计包多次处理能力在同一空间超过上一代设备。这种增加的能力使高性能的产品，如一个软件定义的网络（SDN）开关与额外的开关能力或自动化测试设备（ATE）设备具有更快的吞吐量。然而，更高的处理能力也可能意味着更高的功率要求，与IC和电源模块使用更多的PCB房地产
How can designers recover board space lost to rising power requirements fueled by the need for increased processing capability？ At GE we look at soluTIons to these challenges with a principle we call Designing in the NegaTIve Space.
Designing in the NegaTIve Space （DITNS） looks at a number of engineering approaches to reduce the power module “footprint” on a printed circuit board. For example， making power modules denser while reducing their height enables designers to place them in previously unusable spaces. We see this approach used with GE’s low-height SlimLynx™ family of point-of-load （POL）， or DC/DC converter， power modules that fit under a mezzanine board， or that can be placed on the back of the board， freeing up top-of-board space for taller components. （See Figure 1）
