资 源 简 介
This device is an applicaTIon-specific integrated parts (ASIP) designed to offer system level ESD soluTIons for wide range of portable and industrial applicaTIons. The back-to-back diode array allows AC-coupled or negaTIve-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to provide system level ESD protection for the valuable internal ICs while placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages.
