资 源 简 介
Pushing the Limits of Power
微型化驱动微控制器成越来越小的封装，增加性能。由于控制器内核使用先进的硅制造工艺变得更小，有更多的机会添加外围设备和减少设备的大小。在同一时间，功耗增加从更高的性能，额外的外围设备和增加的漏电流，驱动的热要求。
所有这一切创造了良好的平衡时钟速度，电压和封装技术，以提供最佳的性能为微控制器的微型系统。在微控制器中的电源管理是一个关键因素，在保持系统内的热信封，而无需使用积极的冷却，如风扇，降低了在嵌入式系统中的可靠性。
While passive cooling such as heat pipes can be used to transport the heat away from a heatsink to cooling fins， this increases the size of the system and negates the miniaturizaTIon of the processing. So the management and handling of the power in the controller is a key element in the miniaturizaTIon of the overall system.
The smaller the controllers become， the more focus is on the thermal characterisTIcs of the packaging and the system. Moving to a chip-scale package allows new thermal management techniques to be used such as thermal coaTIngs. This is made more necessary as the silicon die is often made thinner to reduce leakage current and capacitance， but this reduces the thermal reservoir available and potentially makes the die more vulnerable to cracking with thermal imbalances.
