首页| 行业标准| 论文文档| 电子资料| 图纸模型
购买积分 购买会员 激活码充值

您现在的位置是:团子下载站 > 其他 > TI接口芯片资料

TI接口芯片资料

  • 资源大小:2.28 MB
  • 上传时间:2021-06-26
  • 下载次数:0次
  • 浏览次数:60次
  • 资源积分:1积分
  • 标      签: TI接口 芯片

资 源 简 介

Texas Instruments (TI) provides complete interface   soluTIons that empower you to differenTIate your   products and accelerate TIme-to-market.   Our expertise in high-speed, mixed-signal   circuits, system-on-a-chip integration and   advanced product development processes   ensures you will receive the silicon, support   tools, software and technical documentation to   create and deliver the best products on time and   at competitive prices. Included in this selection   guide you will find design considerations,   technical overviews, graphic representation   of portfolios, parametric tables and resource   information on the following families of devices:   LVDS: (p. 4) TIA/EIA-644A specification designed   for differential transmission delivering signaling   rates into the Gbps range and power in the mW   range with low EMI to the telecommunication and   consumer markets.   xECL: (p. 4) Emitter coupled logic (xECL),   high-speed differential interface technology   designed for low jitter and skew.   CML: (p. 4) Current-mode logic (CML), high-speed   differential interface technology.
VIP VIP