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CADENCE SIP DIGITAL ARCHITECT

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  • 上传时间:2021-12-10
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  • 标      签: Cadence

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CADENCE SIP DIGITAL ARCHITECTSystem-in-package (SiP) implementaTIon poses new hurdles for system architectsand designers. Increasing the number of IC die not only introduces more overallcomplexity, but these die sharing the same power grid within a package substratealso makes power delivery more complex. To address these and other challenges,CadenceSiP Digital Architect provides a unique environment to explore, define,and opTImize system connecTIvity and funcTIonality between ICs, SiP substrates,and target printed circuit board (PCB) systems.
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