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The maximum power that can be safely dissipated by the AD8012is limited by the associated rise in juncTIon temperature. The maximumsafe juncTIon temperature for plasTIc encapsulated devicesis determined by the glass transiTIon temperature of the plastic,approximately +150°C. Temporarily exceeding this limit maycause a shift in parametric performance due to a change in thestresses exerted on the die by the package. Exceeding a junctiontemperature of +175°C for an extended period can result indevice failure.