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8-Lead LLP Thermal Performance and Design GuidelinesIntroducTIonThe new leadless leadframe package (LLP) provides significantlyincreased power dissipaTIon capability in a TInysurface-mount package. The key feature of the LLP is that ithas a center metal area located directly below the die whichallows a direct path for heat to flow out, providing very lowthermal resistance. When this pad is connected to PC boardcopper to provide heatsinking, values of total thermal resistance(juncTIon-to-ambient) below 40°C/W can be obtained instill air environments.Modelling AssumptionsThe data listed in this application note is derived from finiteelement modelling in which the following assumptions areused:1. DAP (die attach paddle) size = 3.0 mm x 2.2 mm2. Die size = 2.11 mm x 1.63 mm3. Package size = 4.0 mm x 4.0 mm x 0.75 mm4. Power Dissipation = 1W5. Thermal Vias (0.3 mm diameter) = 8
