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高速FPGA印制电路板设计指南

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  • 标      签: 印制电路板

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高速FPGA印制电路板设计指南 Over the past five years, the development of true analog CMOS processeshas led to the use of high-speed analog devices in the digital arena.System speeds of 150 MHz and higher have become common for digitallogic. Systems that were considered high end and high speed a few yearsago are now cheaply and easily implemented. However, this integrationof fast system speeds brings with it the challenges of analog systemdesign to a digital world. This document is a guideline for printed circuitboard (PCB) layouts and designs associated with high-speed systems.“High speed” does not just mean faster communication rates (e.g., fasterthan 1 gigabit per second (Gbps)). A transistor-transistor logic (TTL)signal with a 600-ps rise time is also considered a high-speed signal. Thisopens up the entire PCB to careful and targeted board simulation anddesign. The designer must consider any discontinuities on the board. The“Time-Domain Reflectometry” and “Discontinuity” sections explain howto eliminate discontinuities on a PCB. Some sources of discontinuities arevias, right angled bends, and passive connectors.
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