资 源 简 介
The SN74LVC1G27 performs the Boolean funcTIon Y = A + B + C or Y = A • B • C in posiTIve logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for parTIal-power-down applicaTIons using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.